Session Index

Thin-Film Technology and Optical Engineering

Thin-Film Technology and Optical Engineering IV
Saturday, Dec. 5, 2020  10:30-12:30
Presider: Prof. Chih Jen Yu
Room: 6AB Harvard Lecture Hall
10:30 - 10:45 Manuscript ID.  0506
Paper No.  2020-SAT-S1004-O001
Hong-Yi Lin
Measurement and Prediction of Residual Stress in Optical Notch Filter
Hong-Yi Lin;Chuen-Lin Tien

This work presents multilayer notch filters prepared by electron beam evaporation. The residual stress in notch filters were predicted and measured. The experimental results show that the transmittance meets the requirements, and the difference between the predicted stress value and the measured stress value is about 28 MPa.

10:45 - 11:00 Manuscript ID.  0507
Paper No.  2020-SAT-S1004-O002
Yan-Tong Lai
Measurement of warpage and residual stress of multilayer thin film coated on 8-inch silicon Wafers
Yan-Tong Lai;Chuen-Lin Tien

This work presents the warpage and residual stress in multilayer films coated on the 8-inch silicon wafers. We use the structured-light illumination, fringe reflection technique, and sub-aperture stitching method to measure surface warpage and radius of curvature for wafers. The residual stress in multilayer thin films .

11:00 - 11:15 Manuscript ID.  0432
Paper No.  2020-SAT-S1004-O003
Sheng-Bin Chen
Finite Element Simulated Residual Stress of Flexible Nb2O5/SiO2 Multi-layer Films Deposited by E-gun with Ion-beam Assisted
Sheng-Bin Chen;Kun-Hong Chen;Hsi-Chao Chen;Yu-Ru Lu;Xun Xie;Wei-Lin Chen

The (Nb2O5/SiO2)4 multi-layer film was deposited by E-gun with ion-beam assisted (IAD) on PET substrate. Residual stress was simulated by finite element method and measured by moiré interferometer. The residual stress was compressive and shearing stress was tensor, and the error of finite element simulated was less than 2%.

11:15 - 11:30 Manuscript ID.  0085
Paper No.  2020-SAT-S1004-O004
Hsiang-Chih Cheng
Interface improvement using crosslinkable hole transporting layer for perovskite quantum-dot light-emitting diodes
Hsiang-Chih Cheng;Yen-Hsiang Huang;Chun-Cheng Lin;Zong-Liang Tseng;Lung-Chien Chen Chen

In this report, we investigated and reported a thermally crosslinkable 9,9-Bis[4-[(4-ethenylphenyl)methoxy]phenyl]-N2,N7-di-1-naphthalenyl-N2,N7-diphenyl-9H-fluorene-2,7-diamine (VB-FNPD) film used as the hole transporting layer of perovskite CsPbBr3 quantum-dot light-emitting diodes. And it show pretty good performance.

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11:30 - 11:45 Manuscript ID.  0395
Paper No.  2020-SAT-S1004-O005
Chun Sheng Huang
A Method of Growth Inorganic Cesium Lead Bromide Perovskites film on P-GaN substrate by Chemical Vapor Deposition
Chun Sheng Huang

Here propose a method to grow an inorganic perovskite CsPbBr3 thin film on P-GaN substrate by low pressure chemical vapor deposition (LPCVD). We optimized the growth parameters by optical property of radiative. We achieve the preliminary perovskites LED structure with growing perovskite by LPCVD, ZnO layer and silver contact.

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11:45 - 12:00 Manuscript ID.  0471
Paper No.  2020-SAT-S1004-O006
Wei-Yung Weng
Development of a real-time image recognition system for driving birds away
Ming-Hong Chang;Wei-Yung Weng;Yu-Pin Lan

This research successfully developed a real-time image recognition method to count the number of birds and drive birds off, including a laser source, an algorithm for image recognition, motor control units, and solar-charged devices. The image recognition algorithm successfully counts the high-speed moving object on CCDs.

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12:00 - 12:15 Manuscript ID.  0754
Paper No.  2020-SAT-S1004-O007
Ho-Yu Yang
Low stress Diamond-like Carbon film applied to Anti-reflection film of thermal imaging system
Ho-Yu Yang;Zi-Jie Xu;Chien-Cheng Kuo

Diamond-Like Carbon film applied to anti-reflection film under 450 W radio-frequency power and 800W microwave power was used to coat the diamond-like carbon film for 90 minutes. The infrared transmittance in the 3~5μm band can reach 71.18%, and the hardness can reach 5.27 GPa.

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12:15 - 12:30 Manuscript ID.  0555
Paper No.  2020-SAT-S1004-O008
Chien-Te Liu
Conductive property for the photo-polymerization additive manufacturing component
Chien-Te Liu;Hsi-Fu Shih

This paper used silver power mixed with photosensitive resin and applied two photo-polymerization configurations to the 3D printing. By changing different parameters, the printing resolution and solidification could be compared It was verified that the feasibility of producing conductive components using the technology of photo-polymerization additive manufacturing.